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TATC

Advanced Computing for Southeast Asia

9/11 Moo 12, Khlong Song, Khlong Luang District, Pathum Thani 12120, Thailand
info@tatc.cloud

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  1. Services
  2. /Next-generation GPUs
Roadmap

MI355X and B300 accelerator options

Compare high-memory accelerator architecture, performance characteristics and workload fit for large-scale AI computing.

Roadmap status and manufacturer specifications do not represent available capacity or a committed delivery date.

AMD
Roadmap
AMD MI350 Series

AMD Instinct MI355X

288GB HBM3E accelerator with fourth-generation AMD CDNA architecture for generative AI, training, inference and HPC

Memory
288GB HBM3E
Bandwidth
8 TB/s
TDP
1400W maximum TBP
  • 288GB HBM3E with 8 TB/s on-package memory bandwidth
  • 256 compute units, 1,024 matrix cores and 16,384 stream processors
  • Native MXFP4 compute delivering up to 10.0663 PFLOPS

Figures marked "TBC / est." are preliminary manufacturer specifications and remain subject to confirmation.

View details|Discuss this GPU
NVIDIA
Roadmap
NVIDIA BLACKWELL ULTRA

NVIDIA HGX B300

Eight-GPU Blackwell Ultra platform with 2.1TB HBM3E for AI reasoning, training and inference

Memory
270GB HBM3E
Bandwidth
7.7 TB/s per GPU
TDP
Up to 1,100W per GPU (configurable)
  • Eight Blackwell Ultra GPUs with 2.1TB total HBM3E memory
  • 144 / 108 PFLOPS total FP4 Tensor Core compute (sparse / dense)
  • 62 TB/s total memory bandwidth and 14.4 TB/s NVLink Switch bandwidth

Figures marked "TBC / est." are preliminary manufacturer specifications and remain subject to confirmation.

View details|Discuss this GPU
Workload fit

Match accelerator capabilities to your workload

Share your model size, training or inference profile, memory requirements and preferred software stack with our team.

Discuss GPU requirements

Evaluate the right accelerator for your workload

Tell us your target model, workload profile and infrastructure requirements to compare accelerator options.

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