Roadmap 2026–2027

Next-gen silicon, already on the roadmap

AMD MI35X Series and NVIDIA BLACKWELL Series arrive at TATC's Thailand data centre — reserved in priority order for early customers.

AMD
Coming Soon
AMD MI35X Series

AMD Instinct MI355

288GB HBM3e CDNA 4 — coming to TATC bare metal

Memory
288GB HBM3e
Bandwidth
8 TB/s
TDP
1000W
  • Industry-leading 288GB HBM3e per card
  • Native FP4 datapath for next-generation frontier inference
  • ROCm 6.x full-stack — CUDA model migration supported by our engineers

Specifications finalising with the vendor — figures marked "TBC / est." will be confirmed at announcement.

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NVIDIA
Coming Soon
NVIDIA BLACKWELL Series

NVIDIA B300

288GB HBM3e Blackwell Ultra — coming to TATC bare metal

Memory
288GB HBM3e
Bandwidth
8 TB/s
TDP
~1400W
  • High-capacity 288GB HBM3e unified memory per accelerator
  • Next-generation NVLink 5 scale-out (specs TBC)
  • Full CUDA ecosystem with TensorRT-LLM inference

Specifications finalising with the vendor — figures marked "TBC / est." will be confirmed at announcement.

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Why book early

Priority allocation for early customers

New accelerator supply is tight regionally. Customers who reserve capacity today get first-node allocation, co-designed configurations and locked pricing for the launch window.

Building for the next generation?

Tell us your target model size and context length — we'll match you to the first node that fits.

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